Samsung and AMD sign deal to work together on AI memory chips

Samsung Electronics and AMD have signed a memorandum of understanding to collaborate on next-generation memory for artificial intelligence. The deal includes supplying high-bandwidth memory, specifically the upcoming HBM4, and the companies will also explore a potential partnership in chip manufacturing, known as foundry work.

AMD's CEO, Lisa Su, is scheduled to visit a Samsung chip plant in South Korea to discuss expanding their relationship. Separately, Samsung's CEO is reportedly seeking multi-year supply contracts with major customers to address concerns about potential future shortages of memory chips.